Reaction Assisted Molded Process (RAMP)

Identita licenses RAMP (reaction assisted moulded process) Technology, an exclusive manufacturing process. This versatile electronics packaging technology uses patented low-temperature, low-pressure reaction injection moulding techniques to securely integrate electronics into small form factors such as smart cards, smart tags, key fobs, memory cards and other portable electronic devices. RAMP technology can be used with PVC, Polycarbonate, Teslin™ (i.e. synthetic paper), and a range of other materials for specific properties and applications. RAMP is the first smart card manufacturing process to receive overall Level 3 Certification from the National Institute of Standards and Technology (NIST) for compliance with FIPS 140 Security Requirements for Cryptographic Modules.

This unique encapsulation process provides powerful advantages for electronics packaging, including:

• Injected thermo set polymer encapsulates and forms a protective layer around electronic elements providing superior security and durability
• Low-temperature enables high volume production with minimized cycle times for very high capacity output
• Low-temperature and low-pressure prevents damage to delicate electronics and improves manufacturing yield
• Highly flexible molding enables a wide range of shapes and form factors
• Superior heat and chemical resistance protects against physical and chemical attacks
• Attempting to physically access chip electronics severly damages or destroys the chip
• Same process applies to contact, contactless, and dual-interface smart cards without significant re-tooling
• Allows pre-assembly and testing of electronics, including batteries and LED displays, prior to implantation